On May 7, NEO Semiconductor announced a major breakthrough in its 3D X-DRAM technology series: the industry’s first 3D X-DRAM cell structures based on 1T1C and 3T0C architectures. According to NEO Semiconductor, the new technology is designed to deliver unprecedented density, power efficiency, ...

As memory giants accelerate development in HBM4 and high-layer NAND, hybrid bonding technology is drawing heightened attention. South Korean leaders Samsung Electronics and SK hynix remain behind in key patents, according to a report from ZDNet. The report highlights that Samsung and SK hynix have d...

Amid ongoing U.S. tariff uncertainty, major tech firms are adjusting their production strategies. According to TheElec, Samsung plans to boost Galaxy S25 production by 800,000 units in May, which may be related to efforts to deliver finished products to the U.S. market ahead of tariffs, as the repor...

Amid tightening U.S. restrictions on AI, Chinese cloud companies like Huawei, Tencent and Alibaba seem to be gaining ground on an unexpected market: the Middle East. According to Rest of World, they are steadily gaining ground in the region’s digital infrastructure race, closing the gap with their...

Previous industry sources suggested that NVIDIA was exploring the use of Intel’s 18A process for its gaming GPUs, according to Tom’s Hardware. Now, interest in the 18A node appears to be growing. Chosun Biz notes that Microsoft has reportedly signed a large-scale foundry deal with Intel using th...