SK hynix is pushing its NAND technology forward with the adoption of hybrid bonding. According to Hankyung, the company is developing 300-layer NAND that incorporates this process, joining other leading manufacturers—Samsung Electronics, China’s YMTC, and Japan’s Kioxia—in moving toward full...

Amid heightened attention on Intel’s EMIB (Embedded Multi-die Interconnect Bridge), TSMC is experiencing exceptionally strong demand for its own advanced packaging. According to Economic Daily News, a surge of AI and HPC orders from NVIDIA, Google, Amazon, and MediaTek has driven TSMC’s entire C...

Recently, Eastern Institute of Technology Ningbo— a project that has drawn considerable attention across the tech and academic communities — has now been officially inaugurated. The university is funded and built by Omnivision Group (formerly Will Semi) founder Yu Renrong, with Academician Chen ...

U.S. export controls are hitting global chip-tool makers, and Tokyo Electron (TEL) is scrambling to make up for shrinking orders from China. According to a recent interview with Nikkei, Executive Managing Director for finance Hiroshi Kawamoto says that by fiscal 2026, the company’s equipment for a...

Soaring AI-server memory demand is driving DRAM prices sharply higher—and now PC and notebook makers are feeling the squeeze. Industry sources revealed today that Lenovo has begun notifying clients of coming price hikes, with adjustments set to take effect in early 2026 as market pressures mount. ...