Ahead of a new round of U.S.-China trade talks in Spain from September 14 to 17, Beijing has stepped up pressure on Washington. On Saturday, China’s Ministry of Commerce announced anti-dumping investigations targeting U.S. analog chips from Broadcom, Texas Instruments, Onsemi, and ADI, according t...

According to Economic Daily News, Infineon announced in March that it will launch RISC-V–based automotive microcontrollers (MCUs). Infineon plans to provide samples to partners for product development in 2026, with mass production slated for 2028–2029. Notably, these RISC-V–based MCUs will be ...

According to The Elec, KAIST Professor Kim Jeong-ho noted that HBF (High Bandwidth Flash)—NAND flash stacked like HBM—could become a decisive factor for the future of AI. As the report explains, HBF resembles HBM in structure, with dies stacked and linked by through-silicon vias (TSVs). The key ...

As global data center deployments accelerate, cloud giants are shifting their demand from training AI to inference AI, driving sustained growth in high-capacity memory requirements and causing memory supply constraints to migrate from DRAM to NAND. Supply chain sources reveal that following SanDisk'...

Following the departure of interim Co-CEO Michelle Johnston Holthaus, Intel is facing further senior exits. According to CRN, the company is losing its second Xeon CPU chief architect this year as CEO Lip-Bu Tan pushes to revive the data center business. The report notes that Ronak Singhal, Intel se...