Amid rapid innovation in semiconductor materials technology, 12-inch (300 mm) silicon carbide (SiC) single-crystal substrates have emerged as a key battleground for industry players worldwide. Recently, overseas media reported significant progress by Wolfspeed in the development of 12-inch SiC singl...

Chinese chipmaker GigaDevice, founded in 2005 and claims to be the world’s second-largest SPI NOR Flash supplier, made its Hong Kong market debut on January 13. According to EE Times China, the company offered 28.92 million H-shares in the IPO. Priced at HK$162 per share, the offering reportedly r...

Intel has unveiled its 18A-based Core Ultra 3-series “Panther Lake” processors at CES, but industry attention is already shifting to what comes next. According to Tom’s Hardware, CEO Lip-Bu Tan said in an Intel News video posted on X that the company is “going big time into 14A,” adding th...

Memory price increases are prompting smartphone makers to adjust their production plans. According to South China Morning Post, a global memory chip shortage has led China’s DreamSmart Group to cancel a planned handset launch, with the company confirming that its Meizu brand has scrapped the Meizu...

As previously reported by ZDNet, SK hynix is exploring plans for its first U.S. HBM packaging facility. Meanwhile, the memory giant is accelerating its domestic expansion, announcing today a KRW 19 trillion investment in a new advanced packaging fab, P&T7, at its Cheongju site. The facility is p...