In the continued sluggish consumer electronics market and amidst the booming era of artificial intelligence, semiconductor manufacturers are actively targeting high-performance chips and intensifying the competition over the 2nm process node. TSMC, Samsung, and the newcomer Rapidus are all active...

According to sources cited by Nikkan Kogyo Shimbun, TSMC intends to commence the construction of the second fab in Kikuyo-cho, Kumamoto Prefecture, Japan, in April 2024, with the goal of commencing production before the end of 2026. It is worth mentioning that news about TSMC's plan to build its ...

TrendForce has released the latest spot prices of memory, which have continued to decline due to the impact of the stagnant market conditions. Both DRAM and NAND Flash spot prices have dropped further. The details are as follows: DRAM Spot Market: Compared with last week, the spot market is st...

AI Chips and High-Performance Computing (HPC) have been continuously shaking up the entire supply chain, with CoWoS packaging technology being the latest area to experience the tremors. In the previous piece, "HBM and 2.5D Packaging: the Essential Backbone Behind AI Server," we discovered that th...

TrendForce has released the latest spot prices for DRAM and NAND Flash, indicating that market demand remains weak and there are no signs of a rebound in spot prices. The details are as follows. DRAM Spot Market: Similar to the contract market, the spot market is still showing weak demand, and...