As TSMC preps for 2nm mass production in the second half of 2025, it is also accelerating advanced packaging expansion to meet strong demand, with a shifting focus beyond CoWoS. According to Commercial Times, NVIDIA’s next-gen Rubin GPU will join AMD and Apple in adopting TSMC’s SoIC (System on ...

As China seeks to cut reliance on Western chipmaking machines such as extreme ultraviolet (EUV) lithography systems, the country has been pushing existing deep ultraviolet lithography (DUV) to its limits. According to Bloomberg and South China Morning Post, Huawei-linked SiCarrier may enable domesti...

Malaysia is planning to strengthen its semiconductor regulations in response to U.S. pressure, aiming to curb the transfer of advanced AI chips to China, as noted by a report from The Edge Malaysia, citing Financial Times. According to the report, Malaysia’s Trade Minister stated that the U.S. ...

As noted by Central News Agency, since China is actively expanding in mature nodes, the impact of the country's newly added capacity is expected to intensify. TrendForce predicts that China's foundry giant Nexchip will surpass Taiwanese foundries VIS and PSMC, moving up from 10th to 8th place i...

According to Economic Daily News, citing Chosun Ilbo, Samsung Electronics Chairman Lee Jae-yong attends the China Development Forum (CDF) in Beijing. Notably, on March 22, Lee visited Xiaomi’s electric vehicle (EV) plant and held a meeting with Xiaomi Chairman Lei Jun. Qualcomm CEO Cristiano Amon ...