During the 2025 Shanghai Auto Show, Intel announced new partnerships with companies including Black Sesame Technologies, Model Best, and BOS Semiconductors, aiming to collaboratively cross technological hurdles in the automotive intelligence process and build an open, mutually beneficial smart vehic...

As memory giants gear up for the next-gen HBM battle, JEDEC has officially released the JESD270-4 HBM4 standard in mid-April. With AI models and HPC workloads demanding faster, larger memory, HBM4 is arriving just right on time. As per JEDEC’s press release, one of the major improvements in HBM...

While the U.S. has temporarily spared chips from tariffs, Beijing's heavy retaliatory levies on U.S. semiconductors create uncertainty in the sector. But according to TechNews and Chinese media outlet mydrivers, chips from Qualcomm, Intel, and Texas Instruments may soon get a pass — with storage...

Intel held its Q1 2025 earnings call on Thursday. According to Reuters, attention centered on the disclosure that CEO Lip-Bu Tan had recently met with TSMC CEO C.C. Wei and former chairman Morris Chang, as well as on the impact of trade uncertainties on Intel’s outlook. As highlighted by Reute...

Amid weak Q2 guidance, Intel CEO Lip-Bu Tan unveiled a series of sweeping changes to reshape the company—starting with major layoffs, cost cuts, and more. According to Intel’s press release and media reports, layoffs affecting up to 20% of the workforce are set to begin in Q2, with 2025 capex ta...