Intel has been making significant efforts to revive its foundry business, and signs of progress are beginning to emerge with the upcoming launch of its 18A process. According to Wccftech, Intel is expected to showcase the process at the 2025 VLSI Symposium, and the company has recently disclosed maj...

As TSMC advances its U.S. expansion, growing attention has been placed on the contribution of its Arizona operations. According to its 2024 annual report, TSMC’s Arizona facility posted a loss of nearly NT$14.3 billion last year, making it the company’s most costly overseas site. In contrast, it...

As the U.S.-China chip war heats up, China is going all-in on AI ASICs, with Huawei’s flagship chips stealing the spotlight. But with rumors of the Ascend 920 entering mass production in 2H25, Commercial Times raises doubts about SMIC’s N+3 process and the chip’s access to top-tier HBM. Acc...

As EUV machines are now essential for pushing sub-2nm chips into mass production in the angstrom era, partnerships with ASML remain a key industry focus. However, according to etnews, ASML and Samsung appear to have dropped plans for their joint EUV research center in Hwaseong, as ASML has begun sel...

As leading memory giants ramp up preparations for the next-generation high bandwidth memory (HBM) battle, JEDEC—the standards-setting body for the microelectronics industry—has officially released the JESD270-4 HBM4 standard, a new memory standard designed to meet the surging demands of AI workl...