While Samsung races full steam ahead with its 12hi HBM3e validation and HBM4 development, Micron stays under the radar. But according to New Daily, the U.S. memory giant is quietly gaining ground—its 12hi HBM3e yields are rapidly improving, earning rave reviews from major CSPs. Citing Micron’...

According to Chinese media outlet ICsmart, Xiaomi CEO Lei Jun announced on the evening of May 15 that the company’s self-developed smartphone SoC, XRING 01, will be officially launched in late May. However, as the report notes, he did not disclose further details about XRING 01. As the report p...

Amid tightening U.S. export controls, NVIDIA has seen a sharp revenue decline in China. According to Economic Daily News, citing Financial Times, the company reportedly plans to set up a new R&D center in Shanghai to bolster its position in the market. The center will focus on solutions tailored...

According to South Korean media outlet The Bell, Samsung Electronics and SK hynix are reportedly delaying the adoption of ASML’s high-NA EUV lithography equipment in their DRAM production, citing the steep cost of the tools and upcoming shifts in DRAM architecture. 3D DRAM Architecture Won’t ...

Unlike Dutch chip tool giant ASML, which recently signaled stronger-than-expected demand from China, Applied Materials struck a more cautious tone for the current quarter, with U.S. export curbs and tariffs continuing to pressure sales in China, one of its key markets, according to Reuters and Bloom...