He Tingbo, President of Huawei's Semiconductor Business Unit, has recently been appointed as Head of the Senior Talent Compensation Division at Huawei. The internal announcement was officially released on July 1, with the appointment order signed by Huawei founder and CEO Ren Zhengfei on June 27. ...

According to Israeli media outlet CTech, NVIDIA is seeking to acquire land in northern Israel for the development of a large-scale campus. The total investment—including land and construction—is expected to reach several billion dollars. If the plan moves forward, the site could become Israel’...

While TSMC plans to exit the gallium nitride (GaN) wafer foundry business by 2027, industry heavyweight Infineon is ramping up its efforts. Leveraging its strong IDM model, Infineon, according to its press release, is advancing its scalable GaN production on 300mm wafers, with first customer samples...

According to Bloomberg, sources say the U.S. Commerce Department is drafting new rules to restrict shipments of advanced AI chips to Malaysia and Thailand, as part of a broader effort to crack down on suspected chip smuggling into China. As noted by Tom’s Hardware, citing Bloomberg, a prelimina...

As UMC looks beyond mature nodes to drive growth, Economic Daily News suggests that the Taiwanese foundry has landed a major advanced packaging order from Qualcomm. Its self-developed high-end interposer has passed Qualcomm’s verification and is now nearing mass production, the report adds. UMC...