According to a report from ZDNet on July 15, Hanmi Semiconductor Chairman Kwak Dong-shin dismisses speculation that the company will adopt a hybrid bonder system for now, stating that Hanmi’s TC bonders are sufficient for HBM4 and HBM5, following JEDEC’s April decision to relax AI packaging thic...

According to TechNews, citing South Korean outlet Chosun Biz, Marvell is reportedly working with TSMC to strengthen its position in the custom ASIC space by leveraging TSMC’s sub-3nm process technology. In addition, the report notes that Marvell is set to adopt TSMC’s silicon photonics technolog...

Malaysia’s trade ministry announced on Monday that the export, transshipment, and transit of high-performance AI chips of U.S. origin will now require a trade permit, effective immediately, according to Reuters. As Economic Daily News notes, Malaysia is a major hub for AI server production, raisin...

During Jensen Huang’s visit to Beijing, NVIDIA revealed that the AI chip giant plans to restart sales of its H20 AI accelerator in China, after receiving assurances from the U.S. government that export licenses will be granted, according to Bloomberg. Notably, as per South Korean media outlet B...

The iPhone 17 series, along with new Macs, Apple Watches, and other upcoming products, is set to launch in the second half of the year, marking a new phase in Apple’s in-house chip strategy. According to industry sources, Apple is  reportedly developing at least seven unreleased chips, including ...