Subject


IC Design


2023-08-30

[News] Huawei Mate 60’s Kirin 9000s: SMIC Production, Old Tech or US Restriction Break?

IC Design

According to a report by Taiwan's TechNews, the Huawei Kirin 9000S mobile processor, dubbed by Chinese media as "4G technology with 5G speed," was incorporated into the Huawei Mate 60 Pro smartphone on the 29th. The phone was made available for purchase directly without a launch event or prior promo...

2023-08-30

[News] Intel’s Processor Upgrades: Impact on TSMC’s Revenue Awaited

IC Design

According to Taiwan's TechNews report, Intel has revealed the architecture and supply schedule of the new generation data center Xeon processors, Sierra Forest and Granite Rapids. They are also set to unveil the consumer processor codenamed Meteor Lake in mid-September. However, with the semiconduct...

2023-08-28

[News] NVIDIA’s Financial Forecast Stands Out, Yet Short-Term Semiconductor Market Weakness Remains

IC Design

NVIDIA Beats Expectations with Q2 Financial Results and Optimistic Q3 Outlook, But Overall Semiconductor Short-Term Prospects Remain Weak, According to Taiwan's Central News Agency. While the semiconductor industry remains subdued, NVIDIA stands out with robust operational performance and a posit...

2023-08-25

TrendForce Dives into NVIDIA’s Product Positioning and Supply Chain Shifts Post Earnings Release

IC Design

NVIDIA’s latest financial report for FY2Q24 reveals that its data center business reached US$10.32 billion—a QoQ growth of 141% and YoY increase of 171%. The company remains optimistic about its future growth. TrendForce believes that the primary driver behind NVIDIA’s robust revenue growth st...

2023-08-23

[News] TSMC Faces Capacity Shortage, Samsung May Provide Advanced Packaging and HBM Services to AMD

IC Design

According to the Korea Economic Daily. Samsung Electronics' HBM3 and packaging services have passed AMD's quality tests. The upcoming Instinct MI300 series AI chips from AMD are planned to incorporate Samsung's HBM3 and packaging services. These chips, which combine central processing units (CPUs), ...

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