Subject


Emerging Technologies


2026-01-05

[News] Largan Precision Reportedly Teams Up With TSMC on CPO; Samples Said to Involve AMD

As AI data transmission volumes continue to surge, the shift toward optical interconnects is gaining momentum, with Taiwan’s Largan Precision, a key optical lens supplier in Apple’s supply chain, reportedly poised to benefit. According to Economic Daily News, sources say Largan is expanding into...

2026-01-05

[News] Google Led TPU Innovation with Patent Spike; Broadcom, MediaTek Reportedly Boost Reserved Wafers

As Google intensifies its push for Tensor Processing Units (TPUs), aiming to secure more orders from major tech players, the company’s R&D efforts are clearly bearing fruit. Nikkei reports that the company has sharply increased patent filings for AI data-center semiconductors, with application...

2026-01-02

[News] OpenAI Reportedly Shifts First AI Hardware Order from China’s Luxshare to Foxconn

OpenAI is gearing up to launch its first AI hardware product, and industry attention is increasingly focused on the potential manufacturing partner behind the project. According to Economic Daily News, citing sources, the device was originally planned to be outsourced to Chinese electronics manufact...

2025-12-31

[News] 2025 Tech Layoffs: Meta, Amazon, Microsoft and Others Cut Tens of Thousands of Roles

As 2025 draws to a close, major technology companies have continued to reshape their workforces amid shifting market conditions, cost pressures, and accelerating investments in AI. Below is a roundup of notable layoffs announced throughout the year, highlighting how some of the industry’s biggest ...

2025-12-29

[News] SK hynix Reportedly Plans First U.S. 2.5D Packaging Line, Eyes Turnkey HBM to Challenge TSMC

As SK hynix continues to advance next-generation memory, the company is also reportedly moving to build capabilities in cutting-edge packaging technologies. According to ZDNet, sources say SK hynix is preparing to set up its first 2.5D packaging mass-production line at a new U.S. packaging facility ...

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