While TSMC’s Arizona expansion races ahead, its Japan operations are moving at a slower pace, drawing close attention. Plans for Kumamoto Fab 2, however, may be shifting. A Nikkei report had suggested a move to 4nm—originally planned for 6nm and 7nm—but Mirror Media now reports a bolder plan: ...

With glass substrates gaining traction as a next-generation packaging solution, Japan’s Dai Nippon Printing (DNP) is stepping up its efforts. According to EE Times Japan, the company will begin phased operations of its newly established pilot line for TGV (Through-Glass Via) glass core substrates ...

Global IDM leaders are charting contrasting strategies in the GaN sector. NXP reportedly plans to phase out its radio power product line and close its GaN RF fab in Arizona by 2027, while onsemi is taking an aggressive approach, partnering with GlobalFoundries to co-develop and produce advanced GaN ...

As SK hynix ramps up ties with major tech players like NVIDIA, advancing U.S. production through its Indiana advanced packaging plant is just one part of its strategy. According to the Puget Sound Business Journal via The Guru, the memory giant has now secured a new office in Seattle’s Bellevue ar...

Samsung has officially unveiled its long-awaited Exynos 2600, developed by its Device Solutions (DS) division and manufactured by Samsung Foundry. According to Business Post, the Exynos 2600 is the industry’s first application processor built on a 2nm Gate-All-Around (GAA) process. On the 19th, Sa...