As per foreign media reports, Taiwan Semiconductor Manufacturing Company (TSMC) is preparing to implement large-scale price adjustments over the coming years—a move expected to significantly impact chip production costs for major clients like Apple and NVIDIA. The driving forces behind this pricin...

As Huawei debuted the second-generation trifold smartphone, the Mate XTs, on September 4, the spotlight turned to the company’s bold return to high-end silicon. According to Huawei Central, mydrivers and The Paper, Huawei Consumer Business Group Chairman Richard Yu officially confirmed at the laun...

Despite geopolitical headwinds, NVIDIA’s H20 AI chip remains in strong demand among Chinese cloud giants. According to Reuters, Alibaba, ByteDance, and other major tech firms are still actively seeking to secure the chip, even as Beijing pressures them to scale back such purchases. Notably, Reu...

According to Chinese media outlet Mydrivers, sources say that Xiaomi’s next-generation XRING O2 will debut next year, possibly launching first with the Xiaomi 16S Pro. However, as the report indicates, like the previous XRING O1, it is still expected to be manufactured on a 3nm process rather than...

As fan-out panel-level packaging (FOPLP) gains traction among semiconductor leaders like TSMC, Japanese companies—long known for their materials expertise—are stepping into the spotlight as well. Resonac, according to Nikkei and its press release, has announced JOINT3, a joint development fra...