SK hynix is expected to continue using its MR-MUF process for HBM4 16-high products. According to DealSite, the company evaluated adopting fluxless bonding for HBM4 16-high but ultimately opted to retain its existing advanced MR-MUF process, concluding that the technology remains premature given per...

Just days ahead of its January 15 earnings call, TSMC stepped up its U.S. push with a US$197 million land purchase for a future gigafab — a move that signals the foundry giant is preparing for another major wave of investment. The New York Times and The Wall Street Journal report that Washington i...

Focal plane arrays (FPAs) have attracted widespread attention in the field of polarization imaging due to their high level of integration, robustness, and strong dynamic adaptability. The key to fabricating FPAs lies in producing arrayed anisotropic subwavelength gratings. Conventional techniques su...

Multiple industry players have been working to advance glass substrates, with LG among them, though the Korean company is reportedly recalibrating its timeline. According to ZDNet, LG had previously anticipated large-scale commercialization around 2028 but has since pushed its outlook to 2030, citin...

China’s domestic chip equipment push is gaining momentum. According to Commercial Times, citing Jiemian News, data released in January by the China Semiconductor Industry Association show that the share of domestically manufactured semiconductor equipment used in China rose from 25% in 2024 to 35%...