According to a report by Taiwan's Economic Daily, TSMC's CoWoS advanced packaging capacity is running at full throttle. As they actively expand their production capabilities, there are reports of major customers like NVIDIA increasing their orders for AI chips. Additionally, industry giants like AMD...

Source to China Times, the International Semiconductor Industry Association (SEMI) forecasts that from 2023 to 2026, the global semiconductor industry will add 12 new 8-inch wafer fabs, with 8-inch fab monthly production capacity increasing by 14% to a historic high of 7.7 million wafers. In respons...

The competitive advantage of automotive GaN components is becoming increasingly prominent. Leveraging their exceptional material characteristics, SiC components are rapidly making inroads into sectors such as automotive, renewable energy, and power PFC. Similarly, GaN components are excelling in ...

According to Taiwan's Business Next, as Moore's Law gradually reaches its limits, semiconductor manufacturers are transitioning from 2D to 3D chip stacking and packaging to increase transistor counts for improved performance. The final step, "packaging," has become crucial. In line with this trend, ...

Fueled by an AI-driven inventory stocking frenzy across the supply chain, TrendForce reveals that Q2 revenue for the top 10 global IC design powerhouses soared to US $38.1 billion, marking a 12.5% quarterly increase. In this rising tide, NVIDIA seized the crown, officially dethroning Qualcomm as the...