AI Chips and High-Performance Computing (HPC) have been continuously shaking up the entire supply chain, with CoWoS packaging technology being the latest area to experience the tremors. In the previous piece, "HBM and 2.5D Packaging: the Essential Backbone Behind AI Server," we discovered that th...

TrendForce has released the latest spot prices for DRAM and NAND Flash, indicating that market demand remains weak and there are no signs of a rebound in spot prices. The details are as follows. DRAM Spot Market: Similar to the contract market, the spot market is still showing weak demand, and...

According to TrendForce's "2023 GaN Power Semiconductor Market Analysis Report - Part 1," the global GaN power device market is projected to grow from $180 million in 2022 to $1.33 billion in 2026, with a compound annual growth rate of 65%. The development of the GaN power device market is primar...

High Bandwidth Memory (HBM) is emerging as the preferred solution for overcoming memory transfer speed restrictions due to the bandwidth limitations of DDR SDRAM in high-speed computation. HBM is recognized for its revolutionary transmission efficiency and plays a pivotal role in allowing core compu...

The global automotive industry is pouring billions of dollars into SiC semiconductors, hoping that they could be key to transforming vehicle power systems. This shift is rapidly changing the supply chain at all levels, from components to modules. In the previous piece "SiC vs. Silicon Debate: Wil...