In early June, NVIDIA CEO Jensen Huang revealed that Samsung’s High Bandwidth Memory (HBM) is still striving on the certification process, but is one step away from beginning supply. On July 4th, a report from Korea media outlet Newdaily indicated that Samsung has finally obtained approval from th...

MediaTek and Xiaomi Group have deepened their collaboration. On July 2, Xiaomi China's Vice President of Marketing and General Manager of the Redmi brand, Wang Teng, announced on Weibo that the joint laboratory between Xiaomi and MediaTek has officially opened at Xiaomi's Shenzhen R&D Center, wi...

China aims to establish at least 50 AI standards by 2026, as outlined in a new draft policy from Beijing, according to a report by South China Morning Post. The draft policy, released on Tuesday by the Ministry of Industry and Information Technology (MIIT), will not only cover training for large lan...

According to a report from Economic Daily News, TSMC's advanced packaging platform SoIC is said to have secured another heavyweight customer, with Apple expected to adopt the technology in 2025. If confirmed, Apple will join AMD as a major client expanding its use of TSMC's SoIC . TSMC has categ...

As semiconductor manufacturing enters the Angstrom Era, there have been significant adjustments in architecture and circuit design. To free up more surface area on chips, moving power delivery to the backside has become a mainstream consensus, making the Backside Power Delivery Network (BSPDN) the...