SK Hynix announced today that it has commenced mass production of the world’s first 12-layer HBM3E product with 36GB of capacity, the largest for any HBM currently available, according to the company. SK Hynix stated that it plans to deliver these mass-produced units to customers by year-end, m...

Driven by the massive demand for AI chips, advanced packaging is in short supply, and the development of three major advanced packaging technologies CoWoS, SoIC, and FOPLP is booming. In addition, two major billion-dollar projects in China have made recent progress, further advancing the region's ad...

While South Korean memory giants Samsung Electronics and SK hynix saw their sales in China double in the first half of this year, the country as a whole seems to heavily rely on China for essential semiconductor raw materials as well, with silicon, germanium, gallium and indium seeing the largest in...

According to TrendForce's latest memory spot price trend report, regarding DRAM, reball DDR4 and DDR5 chips stripped from modules continue to flow into the spot market, adversely affecting the market outlook. As for NAND flash, contract prices for 3Q24 have exhibited signs of loosening. Some module ...

Global Unichip Corp. (GUC), a leading provider of advanced ASIC solutions, announced that its 3nm HBM3E Controller and PHY IP have been adopted by a major cloud service provider and several high-performance computing (HPC) companies. The cutting-edge ASIC is expected to tape out this year, featuring...