Subject


Semiconductors


2024-11-04

[News] SK hynix Introduces World’s First 16-High HBM3E, Providing Samples in Early 2025

South Korean memory giant SK hynix has introduced the industry’s first 48GB 16-high HBM3E at SK AI Summit in Seoul today, which is the world’s highest number of layers followed by the 12-high product, according to its press release. According to SK hynix CEO Kwak Noh-Jung, though the market ...

2024-11-04

[News] TSMC’s CoWoS Prices May Rise 20%; ASE and Amkor Compete for Outsourcing Orders

Driven by booming demand for AI chips, TSMC's advanced CoWoS (Chip on Wafer on Substrate) packaging faces a significant supply shortage. In response, TSMC is expanding its production capacity and is considering price increases to maintain supply chain stability. According to a recent report from ...

2024-11-04

[News] GlobalFoundries Fined by U.S. for Supplying Chips to Affiliate of China’s SMIC

Ahead of the upcoming presidential election and shortly after the TSMC-Huawei investigation, U.S.-based GlobalFoundries, the world’s third largest foundry company, was fined by the U.S. government for USD 500,000 for unauthorized shipments of chips to SJ Semiconductor, an affiliate of blacklisted ...

2024-11-04

[News] Empowered by New Technology: Is Optical Disk Storage Set for a Comeback?

Media report that researchers at the University of Chicago and Argonne National Laboratory (ANL) have developed a new optical storage technology that could surpass the density limitations of traditional optical disks, achieving ultra-high-density storage. In the past, a key challenge for traditio...

2024-11-04

[News] Huawei’s Ren Zhengfei Recognizes U.S. Tech’s Quality but Says Huawei Must Build Its Own

According to a report from South China Morning Post, Huawei Technologies founder and CEO Ren Zhengfei stated that he admires the “openness and inclusivity” of the U.S. tech community. However, Huawei “had no choice” but to build its own tools because of U.S. sanctions. The report quoted a...

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