Samsung Electronics unveiled its year-end leadership reshuffle on November 27, aiming to drive the company's next phase of growth and bolster its future competitiveness, with a strong focus on the semiconductor business. Jeon Young-hyun, who was appointed head of the Device Solutions (DS) divisio...

Advanced packaging remains a hot topic, with multiple projects worldwide making significant progress. TSMC Establishes First Advanced Packaging Zone According to reports from Taiwanese media, TSMC has acquired 30 hectares of land in the Southern Taiwan Science Park to establish its first "Advanced...

Is one of the largest purchases in the tech industry turning into a mirage? According to the latest report by Bloomberg, Qualcomm's interest in acquiring Intel has waned, as the challenges involved in acquiring the entirety of Intel have made the deal less appealing to the U.S. chip giant. Howeve...

According to the latest report by Yonhap News, Samsung Electronics has informed several senior executives of their dismissal and will commence its year-end personnel reshuffle earlier than usual on November 27. The report highlights that Samsung’s Device Solutions (DS) Division, which oversees ...

The U.S.-China chip trade conflict is anticipated to intensify following Donald Trump's election as President. According to a report from MoneyDJ, citing the Reuters, a senior executive from NVIDIA recently met with Chinese officials, even as the Biden administration moves forward with plans to impl...