Just ahead of President Trump’s approval of NVIDIA’s H200 exports to China, Bloomberg reported that rising AI chip contender Cambricon Technologies is aiming to more than triple its AI chip output in 2026 as competition with Huawei intensifies. TrendForce cautions, however, that intense compe...

On December 4, 2025, Jiufengshan (JFS) Laboratory announced a major technological breakthrough — the successful development of a gallium nitride (GaN) power module. Roughly the size of a thumb, these “black boxes,” each about as large as a million thumbnails, can be integrated into a 1-gigawat...

China has been moving to strengthen technological self-reliance in semiconductor equipment, a shift that is increasingly seen as putting pressure on Korean companies. According to Hankyung, citing sources, the Chinese government is said to be encouraging domestic tool adoption through a so-called �...

As SK hynix pushes ahead with HBM4 production, attention is turning to TC bonder suppliers. According to The Elec, citing sources, SK hynix has placed a new order for thermal compression (TC) bonders with Singapore-based ASMPT to support HBM4 manufacturing. The order reportedly comes amid an ongoing...

As a key beneficiary of Google’s TPU boom, U.S. chipmaker Broadcom’s ASIC business is drawing heightened attention. On its latest earnings call, despite Broadcom usually keeps its major clients under wraps, CEO Hock Tan revealed that the company’s $10 billion custom-chip megadeal came from AI ...