According to Chosun Biz, citing a report published by the Korea Institute of Science and Technology Evaluation and Planning (KISTEP), as of last year, China has surpassed South Korea in foundational capabilities across all technology sectors, with the exception of advanced packaging. Even in the ...

As memory giants fiercely compete to push the limits of NAND technology, a surprising twist has emerged: Samsung is reportedly set to use a hybrid bonding patent from China’s YMTC, starting with its V10 (10th generation) NAND, according to the latest ZDNet report. The report indicates that Sams...

Despite the market downturn, SK hynix, a leader in the HBM sector, is expanding into the NAND business. According to Business Korea, the company is set to complete its $8.844 billion acquisition of Intel's NAND business in March, aiming to strengthen its position in the global NAND market, particula...

Previously, speculation circulated that NVIDIA might reduce its CoWoS orders from TSMC. However, according to Economic Daily News, TSMC’s advanced packaging orders have experienced an upsurge. Sources indicate that NVIDIA’s latest Blackwell architecture GPU chips are in strong demand, and the...

Eager to showcase its edge in advanced nodes, Intel has launched a website for its 18A (1.8nm) process, highlighting its readiness for third-party customers and planned tape-outs in the first half of 2025. According to Liberty Times, this puts Team Blue slightly ahead of its archrival, TSMC, whic...