[News] Hanmi Semiconductor Reportedly Receives Terafab Packaging Tool Order, Eyes HBM TC Bonder Supply

Hanmi Semiconductor has reportedly entered the supply chain of Terafab, Elon Musk’s massive AI semiconductor project in Texas. According to Hankyung, sources say the company recently signed a purchase order (PO) with Terafab for packaging equipment used in AI system semiconductors. The equipment is expected to be deployed on Terafab’s advanced packaging production lines, though details such as the contract value, order volume, and delivery schedule have not been confirmed. The deal would mark the first time a South Korean semiconductor back-end equipment maker has entered Terafab’s supply chain.

Notably, the report says Hanmi Semiconductor Chairman Kwak Dong-shin is also discussing expanding the range of products supplied to Terafab. The talks reportedly include the potential supply of thermal compression (TC) bonders used in HBM production.

Terafab reportedly placed significant orders for front-end equipment with major global suppliers, including ASML, Applied Materials, Lam Research, and Tokyo Electron, in 2Q26. Reuters reported in July that ASML had incorporated expected demand from Terafab into its capacity expansion plans for 2027 and 2028. ASML CFO Roger Dassen said the company was in discussions with customers over their fab buildout plans, with Terafab included in those projections.

Hankyung notes that the reported Hanmi deal could signal that Terafab is beginning to place orders for back-end equipment as well. The report adds that U.S. companies have historically relied heavily on Taiwanese firms for back-end processes such as packaging and testing. As Terafab moves into back-end equipment procurement, the project could open a new market for South Korean packaging equipment makers.

Hanmi is not the first South Korean equipment maker reportedly tapped by Terafab. HPSP previously secured a Terafab order for its high-pressure hydrogen annealing (HPA) system, according to the report. The front-end tool uses high-pressure hydrogen to repair microscopic defects on wafers.

Hanmi Deepens U.S. Push With Terafab in Focus

The Terafab order also comes as Hanmi steps up its push into the U.S. AI semiconductor market. According to Yonhap News, the company established HANMI USA in San Jose in August with a US$1.5 million investment, with operations expected to begin in 4Q26. Hanmi said the move is aimed at responding to rising U.S. semiconductor equipment demand driven by HBM and AI chip investment while strengthening technical support for local customers.

Hanmi had already moved closer to the Terafab project earlier this year. According to Yonhap News, the company announced in June that it would acquire KRW 50 billion worth of SpaceX shares, citing the future growth potential of both SpaceX and Elon Musk’s Terafab project.

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(Photo credit: Hanmi Semiconductor)