[News] Xiaomi’s Next Foldable Reportedly to Feature Self-Developed XRING O3 Chip, May Use 3nm Process

As competition in the foldable smartphone market intensifies, new details about Xiaomi’s next foldable device have begun to surface, with its chip strategy drawing close industry attention. According to Mydrivers, sources say a Xiaomi foldable smartphone with the model number 2608BPX34C has appeared in a related code repository. Industry observers widely speculate that the device could be the next-generation flagship MIX Fold 5, or it may be directly named the Xiaomi 17 Fold.

The code further reveals that the device carries the internal codename “lhasa” and is expected to be powered by an XRING O3 chip, the report notes. This has drawn widespread attention, suggesting that Xiaomi may skip the XRING O2 designation and adopt a cross-generation naming strategy for its chips.

As the report highlights, the XRING O3 chip is expected to be built on an advanced 3nm process. For Xiaomi, applying an in-house chip to a more complex foldable device could help strengthen its push into the ultra-premium segment.

Meanwhile, XIMITIME notes that Xiaomi MIX Fold 5 is expected to be initially released exclusively in China. While final pricing has not been confirmed, industry sources believe it will be positioned in the premium tier, likely starting at around $1,399. The model number points to a potential August 2026 launch window, and given that “8.16” marks Xiaomi Day, the device could be unveiled at a dedicated event.

The integration of the XRING O3 into a flagship foldable underscores Xiaomi’s growing confidence in its in-house chip development, as XIMITIME points out. Although these processors are currently limited to high-end models in China, the company’s longer-term roadmap suggests it may expand XRING-powered devices to global markets once its ecosystem reaches sufficient scale.

Xiaomi Advances Self-Developed Chips with Cross-Platform Rollout Plans

Regarding the Xiaomi XRING O2 chip, according to Guancha.cn, sources say the chip is expected to launch in August 2026 and will continue to use TSMC’s N3 process. The report adds that the chip is unlikely to see extensive use in smartphones and is instead expected to be deployed primarily in in-vehicle systems.

Xiaomi is actively advancing its self-developed chip business. As noted by ITHome, at a Xiaomi Investor Day event, founder, chairman, and CEO Lei Jun disclosed that shipments of the Xiaomi XRING O1 chip have exceeded one million units. He added that future in-house chips will also be deployed in Xiaomi’s automotive lineup.

ITHome also indicates that the XRING chip lineup is expected to expand across a full ecosystem spanning smartphones, tablets, vehicles, and wearables. Sources cited by the report add that the rollout schedule for next-generation products integrating in-house chips, large AI models, and operating systems has been set, although it is slightly later than previously rumored, with the exact timing yet to be disclosed.

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(Photo credit: Xiaomi)