[News] Samsung Reportedly Moves Custom HBM Logic Die to 2nm Foundry Process for the First Time

Samsung is stepping up its development of custom HBM logic dies. According to ZDNet, sources say the company is designing logic dies for custom HBM using foundry process nodes as advanced as 2nm. The report adds that Samsung Electronics previously applied a 4nm process to the logic die used in HBM4 (sixth-generation HBM), which is set to enter commercial production this year.

As HBM technology advances, the design and manufacturing approach for logic dies has evolved accordingly, the report explains. Beginning with HBM4, which is scheduled for mass production in 2026, the logic die is manufactured using a foundry process rather than a conventional DRAM process, reflecting the performance and power-efficiency advantages of foundry manufacturing.

In Samsung Electronics’ case, the report says the company uses a 4nm process for the HBM4 logic die. This approach is regarded as a strategic move to secure a performance advantage over SK hynix, which has adopted a 12nm process from TSMC.

Custom HBM Poised to Gain Traction in AI Applications

The report notes that demand for custom HBM incorporating 2nm logic dies is expected to be strong in ultra-high-performance AI accelerator applications. Leveraging these advanced logic dies, Samsung Electronics plans to actively target major global technology companies, including NVIDIA, AMD, Broadcom, Amazon Web Services, and OpenAI, with its custom HBM products, the report adds.

Custom HBM refers to an approach in which customer-specific functions are tailored and integrated into the logic die, the report notes. Samsung is said to be building a portfolio ranging from 4nm to 2nm to address a wide range of customer requirements.

Broader adoption of custom HBM is expected to begin with HBM4E (seventh-generation HBM), which is anticipated to launch in 2027, according to the report. In line with this timeline, Samsung Electronics is also advancing not only logic-die process technologies but also next-generation packaging, including hybrid bonding, the report adds.

Read more

• [News] Samsung Reportedly Plans 50% HBM Capacity Surge in 2026, Spotlight on HBM4
• [News] Samsung HBM4 Reportedly Beats Expectations in Broadcom Test, Set to Lead 2026 Google TPU Supply

(Photo credit: Samsung)