[News] TSMC 1.4nm Fab in Central Taiwan Science Park Reportedly to Break Ground in 4Q25

According to Commercial Times, construction on TSMC’s new 1.4-nanometer fab in Central Taiwan Science Park will break ground in the fourth quarter in 2025, Central Taiwan Science Park Bureau Director-General Hsu Maw-shin said, noting that contractors are still finalizing the schedule.

The report adds that with the adoption of a more advanced process, the plant’s estimated output value—originally projected at NT$485.7 billion—could reach NT$500 billion, while employment is expected to remain around 4,500.

As the report indicates, the Phase II expansion of Central Taiwan Science Park will include four fabs for the 1.4-nanometer advanced process, with the first beginning trial production in 2027 and entering mass production in the second half of 2028, making it among the most advanced processes in the world.

Institutional investors cited by the report said TSMC’s advanced process roadmap has been mapped out through 2030. In the second half of 2025, the company is set to begin volume production of 2-nanometer (N2) chips, introducing the GAA semiconductor architecture—its biggest shift since FinFET. In the second half of 2026, TSMC will move to the A16 process, targeting an additional 15% to 20% improvement in performance and energy efficiency.

As noted by Taipei Times, the chipmaker plans to start volume production of 2-nanometer chips next quarter at fabs in Hsinchu and Kaohsiung, while 1.6-nanometer output in Kaohsiung is scheduled for the second half of next year amid surging demand for AI and HPC.

In addition, the company is pressing ahead with advanced packaging capacity. Southern Taiwan Science Park Bureau Director-General Cheng Hsiu-jung said the Chiayi County campus expansions are proceeding as planned, refuting media speculation about a sudden suspension, Taipei Times reported.

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(Photo credit: TSMC)