[News] Intel Reportedly Reaffirms Glass Substrate Roadmap, Pilot Line Rumored in 2025

According to ETNews, Intel’s U.S. headquarters reportedly told the outlet that there has been no change to the company’s glass substrate development plan outlined in its 2023 roadmap. In response to speculation that it might cut staff as part of an exit from the business, Intel stated it does not comment on rumors but reaffirmed its commitment to the roadmap, the report highlights.

The news outlet notes that Intel has reportedly confirmed it is proceeding with the project as planned, indicating its glass substrate adoption efforts remain on track. Sources cited in the report add that Intel is pursuing key technologies for glass substrate manufacturing, with plans to begin pilot line operations in 2025. The pilot supply chain reportedly involves firms from Korea, Japan, and Taiwan.

However, Intel has stated that no decisions have been finalized on mass production. As the report indicates, it therefore remains uncertain whether the company will produce glass substrates in-house or procure them through external partners, since achieving mass production would require large-scale investment. The report also notes that substrate makers and packaging firms from Taiwan, Austria, and Korea are currently being discussed as potential Intel partners.

Intel has long been developing glass substrate technology. As the report states, its roadmap calls for introducing glass substrates before 2030. When announcing the roadmap, Intel stressed it had already devoted a decade to R&D on semiconductor glass substrates and disclosed plans to establish a pilot production line.

Global Push for Glass Substrate Commercialization

Meanwhile, according to South Korean outlet Business Post, citing sources in late August, Samsung is exploring cooperation with Intel on next-generation semiconductor glass substrates. The South Korean giant is pushing toward glass substrate commercialization. According to The Korea Herald, citing sources, Samsung plans to adopt glass substrate interposers for advanced semiconductors by 2028 to “meet customer demands” and has already begun operating a pilot line at its Sejong facility.

Other industry players are making swift progress. As noted by The Korea Herald, Absolics—a subsidiary of SKC—aims to complete preparations for mass production by the end of 2025. The outlet also reports that Absolics is expected to become the first to commercialize glass substrates and has already begun prototype production at its Georgia, U.S., facility.

Read more

• [News] Samsung Reportedly Weighs Intel Packaging Investment, Glass Substrate Tie-Up to Challenge TSMC
• [News] Absolics Reportedly Ramps Up Glass Substrate Output, Mass Production Expected by Year-End

(Photo credit: Intel)