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Despite uncertainty clouding Intel’s 18A roadmap, the embattled chip giant pushes forward with its AI strategy. Wccftech reports that Intel is developing its inaugural rack-scale AI solution powered by Jaguar Shores, which has surfaced online.
Notably, images discovered by a HardwareLUXX editor suggest Jaguar Shores will harness 18A process technology and next-generation HBM4 memory, according to the report.
Team Blue’s AI business has struggled to gain traction. After its once-hyped Gaudi 3 fell short of the $500 million sales target in 2024, according to eeNews Europe, Michelle Johnston Holthaus, then co-CEO, confirmed in early 2025 that Falcon Shores would be scaled back to an internal engineering project and would no longer target the datacenter GPU market.
However, Intel is now aiming for a fresh start in its AI lineup. Wccftech reports that Jaguar Shores features a substantial 92.5mm × 92.5mm package footprint, indicating an HPC-optimized architecture with quad-tile configuration and octal HBM memory subsystems.
While details remain limited, Jaguar Shores represents Intel’s flagship AI chip for rack-scale deployments and is expected to rival NVIDIA and AMD offerings, the report suggests. According to Wccftech, Jaguar Shores will use SK hynix HBM4 memory, integrate multiple domains and IPs, and pair with Intel’s upcoming Diamond Rapids Xeon CPUs, setting the stage for a major AI push.
According to Intel, its 2024-launched Gaudi 3 packs eight HBM2E devices, hinting that Jaguar Shores will have a big leap in memory performance.
Intel’s AI Strategy
After the appointment of a new AI chief, Sachin Katti, in April, Intel’s AI unit is shifting focus to workload-specific solutions, spanning from low-power edge inference to rack-scale data center training, as per Tom’s Hardware.
The report also suggests that while Jaguar Shores remains central to Intel’s AI roadmap, the company is also exploring custom silicon partnerships and new architectures, leveraging its expertise in x86 processors, IPUs, multi-chiplet designs, advanced packaging, and silicon photonics.
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(Photo credit: Intel)