[News] Intel’s Chip Packaging Expert Jumps to Samsung Amid Reported Glass Substrate Retreat

Significant personnel changes are underway at Intel as the company shifts direction under CEO Lip-Bu Tan. According to The Wall Street Journal, Gang Duan, a longtime Intel expert in chip packaging, has left the U.S. firm to join Samsung’s components division. The report highlights Duan’s key contributions to advancing semiconductor packaging technologies, particularly his innovative use of glass materials.

As the report notes, Duan’s LinkedIn profile indicates he left Intel in June after more than 17 years at the company and began his new role as executive vice president at Samsung Electro-Mechanics America in August.

Wccftech notes that Duan’s move to Samsung has raised concerns that Intel may be pulling back from its long-standing efforts in glass substrate technology. Citing sources, the report emphasizes Intel’s lead in this field, built over several years of development. Intel had initially planned to integrate glass substrates into its packaging services by the end of 2025, while competitors were still working out how to implement the approach.

Last month, Wccftech, citing German outlet ComputerBase, reported that industry sources suggest Intel is now considering abandoning its glass substrate efforts.

Meanwhile, The Wall Street Journal notes that Samsung Electro-Mechanics aims to begin mass production of glass substrates by 2027. According to The Korea Herald, the company, which entered the market last year, has reportedly launched a pilot production line at its Sejong facility.

Three Executives Retire as Intel Reshapes Manufacturing Strategy

Other major personnel changes are also taking place at Intel. As per Reuters, three senior executives from its manufacturing operations are set to retire.

According to Tom’s Hardware, two of the departing executives, Kaizad Mistry and Ryan Russell, held positions as corporate vice presidents in Intel’s Technology Development Group. The third, Gary Patton, served as corporate vice president and general manager of the group’s Design Technology Platform organization. Tom’s Hardware notes that Patton is a highly regarded veteran in the semiconductor industry, having previously held leadership roles at IBM and GlobalFoundries.

Reuters further points out, citing sources, that Intel is planning changes within its technology development group, which oversees the creation of manufacturing processes. The company reportedly intends to reduce its manufacturing capacity planning team and cut part of its engineering workforce.

Intel’s broader organizational shake-up comes as it reevaluates its strategy for advanced process development. As Reuters notes, the future of its next-generation 14A manufacturing process depends on securing a major new customer; without one, the project could be delayed or even canceled.

Read more

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• [News] Intel Reportedly Considering Dropping Glass Substrate Project, Eyes External Sourcing

(Photo credit: Intel)