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[News] NVIDIA Reportedly to Procure Up to 800,000 SOCAMM Modules in 2025 for AI Product


2025-07-17 Semiconductors editor

SOCAMM, dubbed “the next HBM”  is beginning to gain traction in the market. According to ITHome, citing South Korean outlet ETNews, NVIDIA is expected to procure between 600,000 and 800,000 units of SOCAMM this year. Wccftech adds that demand is projected to accelerate further in 2026, driven by the introduction of the SOCAMM 2 modules.

Wccftech notes that this increased procurement is intended for deployment across NVIDIA’s AI product lineup. One of the first platforms to adopt the new memory is the GB300 Blackwell. Meanwhile, ETNews mentions that SOCAMM is reportedly also being incorporated into the AI PC “DIGITS,” unveiled at NVIDIA’s GTC 2025 event in May.

Key Technical Features of SOCAMM

Unlike traditional server modules that use DDR5, SOCAMM utilizes LPDDR chips, which are typically found in mobile devices, to achieve greater power efficiency. It vertically stacks advanced LPDDR5X chips to enhance data processing performance while significantly reducing energy consumption, as highlighted by The Korea Herald. The report also notes that SOCAMM’s modular design enables users to easily remove and replace the module for upgrades, adding to its appeal.

According to Micron‘s press release, SOCAMM outperforms traditional RDIMMs by delivering more than 2.5 times the bandwidth, using only one-third the power, and adopting a much smaller 14x90mm form factor—ideal for compact, efficient server designs. It also offers the highest LPDDR5X capacity available, with 128GB per module, enhancing performance for AI model training and inference.

Industry Outlook and Market Impact

As highlighted by Wccftech, Micron is currently manufacturing SOCAMM modules for NVIDIA. Samsung and SK hynix are reportedly in discussions with NVIDIA to manufacture the modules for the company.

Beyond the memory sector, the substrate industry also sees SOCAMM as a strong catalyst for future growth. According to ETNews, the module’s need for dedicated printed circuit boards (PCBs) is generating new demand for the industry.

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(Photo credit: Micron)

Please note that this article cites information from ITHome, ETNewsWccftech, The Korea Herald, and Micron.


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