[News] China’s Chip Tool Push: AMEC Expands 3D Memory Equipment; Wellrun Targets Key Metrology Gap

China’s push to strengthen its semiconductor equipment sector is accelerating. According to STAR Market Daily, the 14th China Semiconductor Equipment, Materials and Core Components Exhibition (CSEAC 2026) has opened, bringing together leading companies across the semiconductor supply chain. Notably, AMEC, China’s leading etch equipment maker, held a product launch alongside the exhibition, unveiling several new high-end etching and thin-film deposition tools developed in-house.

For etching, AMEC introduced the Primo XD-RIE™ system, designed for advanced 3D memory manufacturing with extremely high aspect ratios of 70:1 to 90:1. As the report highlights, the tool uses very-high-frequency RF to optimize etch selectivity and a high-conductance architecture to broaden the process window, allowing it to support the evolving requirements of advanced memory devices.

For thin-film deposition, AMEC unveiled four new tools targeting key processes in advanced 3D memory and logic chips. According to the report, the new Performo QuaStar® PECVD platform includes its first product, Performo QuaStar® ON, which targets silicon oxide/silicon nitride stack deposition in 3D NAND manufacturing. A single system can process up to 16 wafers simultaneously.

Another new thin-film tool, Prefima Unicore™ AM, is AMEC’s self-developed 12-inch atomic layer deposition system for molybdenum, designed for word-line fill in ultra-high-stack 3D structures. As the report indicates, it is expected to become a key piece of equipment as advanced memory chips move toward higher layer counts.

As noted by Zhidx, the latest launches come just six months after AMEC unveiled four new products at SEMICON China in March, further expanding its high-end equipment portfolio. The additions broaden its coverage across advanced logic, power semiconductors, thin-film deposition, and precision etching, strengthening its ability to provide equipment solutions across a wider range of processes and applications.

AMEC was not alone in showcasing new equipment at CSEAC 2026. According to STAR Market Daily, other major participants included Naura and thin-film deposition specialists Piotech and Leadmicro. Piotech showcased deposition and 3D IC equipment, with its PECVD tools ranking first in China in installed base and process coverage. Meanwhile, Leadmicro showcased thin-film solutions for logic, advanced packaging, DRAM, and 3D NAND, with its CVD equipment having entered volume production, the report notes.

Wellrun Advances Domestic CD-SEM, One of China’s Least Localized Chip Tools

Beyond etching and deposition, China’s localization push is also extending to semiconductor metrology and inspection. According to Mydrivers, Wellrun Microelectronics has developed 12-inch CD-SEM (Critical Dimension Scanning Electron Microscope) systems for 22nm volume production and 14nm R&D. Often described as a “mini lithography machine,” CD-SEM has the second-lowest localization rate among semiconductor equipment categories in China, behind only lithography tools.

Several of Wellrun’s metrology and inspection tools have reportedly been deployed and are running steadily on mature-node production lines in China. At CSEAC, the company will showcase its 14nm and 22nm CD-SEM systems, photomask critical-dimension metrology equipment, and an AI-based e-beam metrology platform. Wellrun has also signed a strategic partnership with major Chinese IDM CR Micro to advance domestic substitution of semiconductor metrology and inspection equipment, Mydrivers notes.

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(Photo credit: AMEC)