[News] DNP Advances TGV Glass Substrates, Eyes Early-2026 Sample Shipments, FY2028 Mass Production

With glass substrates gaining traction as a next-generation packaging solution, Japan’s Dai Nippon Printing (DNP) is stepping up its efforts. According to EE Times Japan, the company will begin phased operations of its newly established pilot line for TGV (Through-Glass Via) glass core substrates in December 2025, and plans to conduct verification for mass production and aims to begin shipping sample products in early 2026.

The report adds that, looking further ahead, the company plans to expand its production system with the aim of beginning mass production in fiscal 2028, while continuing to closely track customer demand and market trends. It also notes that the pilot line is located within DNP’s Kuki Plant in Kuki City, Saitama Prefecture.

DNP’s TGV Glass Substrate Offering

As outlined in the company’s press release, TGV glass core substrates are used as core materials for FC-BGA (Flip Chip–Ball Grid Array) applications, positioned between the motherboard and the semiconductor chip. By incorporating large numbers of fine through-glass vias (TGVs), the substrates enable high-density electrical interconnections, while replacing conventional organic resin materials with glass helps further enhance semiconductor package performance.

Despite a relatively large panel size of 510 × 515 mm, the substrate delivers the flatness and rigidity required for next generation packaging, helping to suppress warpage, the press release notes. Regarding its product lineup, DNP plans to offer two variants, a filled type in which the through holes are filled with copper and a conformal type in which a metal layer is formed along the sidewalls of the through holes, the press release adds.

Glass Substrate Development Gains Momentum

DNP is not the only Japanese company advancing in glass substrates. According to Nikkei, Japanese foundry Rapidus is expected to unveil the world’s first interposer prototype cut from a single large glass substrate, with mass production targeted for 2028.

South Korean companies are also stepping up their efforts. Chosun Biz reports that SKC and Samsung Electro-Mechanics are currently shipping prototype glass substrates to customers for evaluation, while SKC subsidiary Absolics is aiming to begin mass production in 2027 and is moving ahead with related preparations.

As for TSMC, Commercial Times reports that the foundry giant has established a dedicated FOPLP (fan-out panel-level packaging) R&D team and production line, pursuing a roadmap that integrates PLP with TGV and glass substrates. While 2027 has been set as the mass-production target, sources cited by the report say the timeline could be brought forward.

Meanwhile, ETNews notes that Intel has been developing glass substrate technology for more than a decade and is aiming to roll out glass substrates ahead of 2030.

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• [News] Rapidus Reportedly to Unveil Glass Substrate Interposer Prototype, Eyes 2028 Production

(Photo credit: DNP)