[News] China’s ACM Reportedly Lands Memory Giant Orders; Eyes HBM4-Compatible Cleaning Systems by 2026

As China’s top memory firms race to advance next-gen DRAM and NAND, domestic chip equipment makers are stepping up for a slice of the booming HBM market as well. According to ijiwei, ACM Research has introduced several solutions optimized for HBM production and plans to release HBM4-compatible cleaning systems by 2026.

Among the equipment already hitting the market, ACM’s flagship Ultra ECP 3D system is drawing particular attention. The platform reportedly handles TSV (Through-Silicon Via) copper filling—a critical step in HBM production. As ijiwei highlights, orders began ramping in H2 2024, landing a heavyweight win with Samsung among its customers.

According to ijiwei, the tool reportedly delivers copper filling for TSV structures exceeding 500 layers in 3D NAND configurations, achieving a remarkable 99.8% yield rate. The equipment is specifically designed to handle the high aspect ratio electroplating requirements essential for HBM fabrication, the report adds.

Beyond Samsung, ACM counts other memory giants as customers. Ijiwei notes that ACM’s SAPS megasonic single-wafer cleaning technology tackles TSV deep-hole cleaning, with the platform already deployed in HBM production lines at SK hynix and Micron. Meanwhile, its TEBO megasonic cleaning technology, which addresses the unique cleaning demands of complex 3D structures like HBM, has passed validation at tier-one chipmakers, with four units already shipped, the report suggests.

ACM Research’s HBM Push

According to eastmoney.com, ACM Research is advancing rapidly in the HBM market. The company plans to launch HBM4-compatible cleaning equipment by 2026, handling 16-layer stacked wafers with 2,048 TSVs. In Q3 2025, it secured an HBM packaging equipment order worth over 200 million RMB from a leading global memory manufacturer, with delivery expected in the first half of 2026, the report notes.

Additionally, ijiwei reports that the company has established a dedicated HBM lab at its South Korea R&D center, signaling aggressive plans to expand its footprint in the fast-growing HBM equipment market.

Read more

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(Photo credit: ACM Research)