[News] SK hynix Unveils Organizational Restructure with Dedicated HBM Taskforce in the Americas

As 2025 draws to a close, tech giants are rapidly reshuffling their organizations. After Samsung reinstated its dual-CEO structure and elevated Roh Tae-moon, SK hynix followed on the 4th with a major move of its own—launching a dedicated HBM taskforce to accelerate its AI-memory push, according to ZDNet and the Chosun Biz.

To provide faster support for key HBM customers, the company is reportedly establishing a dedicated HBM technical unit in the Americas. It is also creating separate teams focused on HBM packaging yield and quality—moves designed to expand its presence in the custom HBM market and build a fully integrated, end-to-end HBM organization, the reports add.

Global Expansion a Key Part of Restructuring

The latest reorganization also puts major weight on global expansion. According to ZDNet, the company will set up Global AI Research Centers in the U.S., China, and Japan, with CTO Ahn Hyun leading the effort. The U.S. center, in particular, aims to bring in “guru-level” talent to push SK hynix’s system research capabilities, as per ZDNet.

At the same time, SK hynix is pressing ahead with its advanced packaging fab in Indiana and launching a new Global Infrastructure division to bolster worldwide manufacturing strength. The unit will be led by Kim Chun-hwan, a veteran with deep experience across the company’s Icheon and Cheongju fabs, the report notes.

As reported by Tech in Asia, the US$3.87 billion chip-packaging and R&D complex in Indiana—backed by US$458 million in direct CHIPS Act funding and up to US$500 million in loans—is slated to start mass-producing HBM chips in the second half of 2028.

Meanwhile, SK hynix is not only launching a Macro Research Center to provide AI- and semiconductor-focused strategic insights and operating a customer-centric “Intelligence Hub,” but is also strengthening its leadership pipeline.

ZDNet and the Chosun Biz note that Manufacturing and technology veteran Lee Byeong-gi has been elevated to Chief Product Officer, where he will drive innovation across the company’s global production network. Yield-and-quality specialist Kwon Jae-soon and eSSD development lead Kim Cheon-seong were likewise promoted to head the M&T unit and Solution Development, respectively, the reports add.

2026 Expansion Strategy

It is interesting to note that as per DealSite, Samsung Electronics and SK hynix are ramping up DRAM production for 2026—but with strikingly different playbooks. The report suggests that while Samsung is betting big on general-purpose DRAM, including DDR5, LPDDR5X, and GDDR7 amid rising memory prices, SK hynix plans to expand output but funnel much of that capacity toward HBM.

Read more

• [News] Memory Price Rally May Run Past 2028 as Samsung, SK hynix Reportedly Cautious on Expansion
• Global DRAM Revenue Jumps 30.9% in 3Q25, Micron’s Market Share Climbs by 3.7 Percentage Points, Says TrendForce

(Photo credit: SK hynix)