[News] Micron Reportedly Poaches Samsung, SK hynix Talent to Bolster HBM at Taiwan’s Taichung Fab

Competition among global memory giants has been intensifying, and Micron has reportedly stepped up its recruitment efforts, actively targeting skilled engineers for its expanding global operations. According to Hankyung, sources indicate that Micron is using LinkedIn to recruit engineers with experience at Samsung Electronics and SK hynix for positions at its Taichung fab in Taiwan.

As the report highlights, Micron’s Taichung facility serves as its largest DRAM production hub and also manufactures HBM, a crucial component in AI applications. Among the positions Micron seeks to fill, many are focused on HBM and packaging, with several senior-level roles included. As the report notes, some senior positions reportedly offer total annual compensation of up to 2 billion KRW (around USD 150,000, including bonuses).

This is not the first time Micron has recruited talent from competitors. However, as eNews Today reports, the company has expanded its hiring scope to the design sector, adding a new role for an HBM Base Die Design Engineer in Korea. The eNews Today report explains that while the HBM base die previously focused on input/output and DRAM functions, with HBM4 it now incorporates core system semiconductor functions such as the memory controller. The goal is to attract engineers with system-level design expertise to develop customized HBM solutions for individual clients.

Meanwhile, Hankyung adds that Micron has extended offers not only to semiconductor engineers but also to employees of foreign semiconductor equipment and display companies operating in Korea.

Micron Steps Up Hiring to Boost HBM Development

Micron has started supplying HBM3E (fifth generation) to NVIDIA, yet it remains behind its competitors in production capacity and design expertise. To close this gap, the company is expanding its DRAM manufacturing bases, including HBM production, in Taiwan, the U.S., Japan, and Singapore, while placing strong emphasis on talent recruitment, as highlighted by eNews Today.

In its most recent earnings release, CEO Sanjay Mehrotra stated that the HBM market is expected to reach US$100 billion by 2030, adding that HBM’s growth rate already surpasses that of standard DRAM and will continue to do so next year, according to Hankyung.

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(Photo credit: Micron)