[News] AMD May Return to GPU Arena with the Launch of 2.5D/3.5D Chiplet-Based GPU

AMD may be gearing up for a comeback in the high-performance GPU arena. As per Tom’s Hardware, AMD SoC chief architect Laks Pappu recently revealed on LinkedIn that the company is developing next-generation GPUs with advanced 2.5D and 3.5D chiplet packaging.

AMD’s current Radeon RX 9000 series, based on the RDNA 4 architecture, has not directly challenged NVIDIA at the high end. The flagship RX 9070 XT roughly matches the performance of NVIDIA’s mid-tier GeForce RTX 5070 Ti. But the disclosure suggests AMD is preparing stronger flagship products for its next wave of GPUs.

Pappu, who oversees both data center GPU development and gaming-focused Radeon roadmaps, highlighted upcoming Navi4x and Navi5x generations, noting his role includes building competitive GPUs powered by 2.5D/3.5D chiplet designs.

It’s learned that GPU powered by 2.5D/3.5D chiplet design improves interconnect bandwidth and power efficiency. Products adopting this technology will be well-suited for high-performance computing and data center markets, which means that AMD is exploring both multi-chip and monolithic chip designs in parallel, aiming to balance performance and cost across market segments.

Although AMD has not yet disclosed specific release timelines or model names, the report emphasized that this news signals AMD’s potential return to high-performance GPU competition market. Advances in multi-chip packaging technology could allow AMD to keep cost under control while boosting performance in data processing and graphics rendering.

(Photo credit: AMD)