[News] SK hynix Launches Industry-First High-K EMC Mobile DRAM with 3.5x Higher Thermal Conductivity

While performance drop caused by heat has become not only an issue for AI data centers but for smartphones as well, SK hynix announced that it has begun supplying mobile DRAM with industry-first High-K Epoxy Molding Compound, offering highly efficient heat dissipation.

According to its press release, with thermal conductivity boosted 3.5 times and vertical thermal resistance reduced by 47%, the new High-K EMC is expected to extend battery life and product longevity by improving smartphone performance while lowering power consumption.

EMC (Epoxy Molding Compound), as SK hynix explains, is a key semiconductor packaging material that shields chips from water, heat, impact, and electrostatic charge, while also serving as a heat dissipation channel. High-K EMC enhances the thermal conductivity of EMC by incorporating Alumina to Silica, the company states.

As the memory giant points out, most flagship smartphones use a package-on-package (PoP) structure, stacking DRAM onto the application processor to maximize space and boost data transfer speeds. However, this design traps heat inside the DRAM, causing performance drops.

The move, therefore, addresses performance drops caused by heat during fast on-device AI data transfers. Global smartphone makers have welcomed the launch, expecting it to ease overheating issues in high-performance flagship models, according to the company.

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(Photo credit: SK hynix)