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According to a report from Economic Daily News, TSMC recently announced that its Q2 revenue reached USD 30.07 billion, setting a new record high. Notably, the report highlights that, as indicated by institutional investors, AI-related business accounted for more than one-third of the quarterly total, surpassing USD 10 billion for the first time. This figure is expected to continue rising, with full-year AI revenue projected to reach a new high, as the report notes.
Institutional investors cited in the report indicate that in Q2, TSMC generated approximately USD 8.78 billion from AI chip manufacturing and advanced packaging, marking a 3.67-fold increase year over year. Revenue from high performance computing (HPC) chips totaled USD 9.26 billion, up 9.8% from the same period last year, including contributions from AI switches and network connectivity-related ASICs. When revenue from AI edge devices and related segments is included, AI accounted for over one third of TSMC’s quarterly revenue, with the share expected to approach half soon.
TSMC raised its full-year revenue growth forecast to around 30%, signaling its growing advantage in the increasingly competitive race for AI manufacturing capacity, as noted by Bloomberg.
As cited by Economic Daily News, TSMC Chairman and CEO C.C. Wei stated that customer demand for AI remains strong despite headwinds such as tariffs and the appreciation of the New Taiwan dollar.
TSMC defined “AI-related demand” during its earnings call earlier this year to include AI accelerators used in data centers for training and inference, such as AI GPUs and AI ASICs. For the first time, this definition also includes HBM controllers, the report adds.
In addition, Economic Daily News reports that while the rebate program in China has provided a short-term boost in demand, TSMC views this impact as temporary. The company continues to expect a modest recovery in the overall non-AI market in 2025 and maintains that semiconductor demand remains fundamentally strong and poised for continued growth.
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(Photo credit: TSMC)