[News] BT Substrate, Fiberglass Prices Reportedly Eye 20% Hike amid AI Boom and Supply Shortage

With TSMC and NVIDIA signaling booming AI demand, the supply chain is heating up and key materials are facing imminent price hikes. According to Commercial Times, BT substrate prices have been climbing since July, and prices for high-end fiberglass fabrics used in IC substrates are also set to rise further in August.

On the materials front, a structural shortage is hitting high-grade fiberglass fabrics. Commercial Times notes that Japanese suppliers have shifted production toward high-margin specialty materials like low-Dk and low-CTE fiberglass, widening the supply gap to over 10%. Starting in August, prices for these high-end fabrics used in IC substrates are expected to jump up to 20%, the report adds.

The report notes that standard fiberglass (E-Glass) sells for $3–5 per kg, high-end grades go for $40–50, while ultra-premium low-Dk/low-Df variants are projected to reach $80–100 per kg—showing the strongest price momentum.

BT Substrate Prices Climb as T-Glass Supply Tightens

Supply chain sources cited by Commercial Times reveal that as supply tightens and raw material costs (like copper and gold) rise, Taiwanese IC substrate makers have been raising prices since July, especially for T-Glass-based BT (Bismaleimide Triazine) products — with increases up to 20% in some cases.

Meanwhile, the report suggests that rising cost pressures are beginning to hit even mid- and low-end products, with memory substrate prices climbing in particular. This upward trend, therefore, could favor leading Taiwanese players like Unimicron, Kinsus, and Nan Ya PCB, the report notes.

In the long run, Commercial Times notes that with new T-Glass capacity from Nitto Boseki not expected until the second half of 2026, the short-term supply crunch is unlikely to ease—giving suppliers continued pricing leverage.

Beyond BT substrates, ABF (Ajinomoto Build-up Film) shipments are surging as well, driven by rising AI chip demand and the shift toward multi-chip and HBM packaging. Commercial Times reports that while high-end ABF products remain profitable with stable prices today, industry sources expect medium- to long-term price increases as substrate sizes expand and T-Glass supplies tighten.

(Photo credit: Nittobo)