[News] Huawei to Unveil First Foldable PC Next Monday, Reportedly Powered By In-house Kirin X90

As Huawei’s Ascend chips take the spotlight under Trump’s new AI rules, the Chinese tech giant is grabbing headlines again—this time with the surprise announcement of its first foldable PC, set to debut on May 19, according to its official Weibo and MyDrivers.

Notably, MyDrivers reports that Huawei’s upcoming foldable PC will run the new HarmonyOS for PCs and be powered by the in-house Kirin X90 chip. It is also said to feature a large foldable display and a built-in linear motor that simulates real keyboard typing.

A teaser on Huawei’s Weibo shows it belongs to the premium “ULTIMATE DESIGN” line, complete with a gold-accented logo that highlights its luxury appeal.

As noted by Tom’s Hardware previously, Huawei’s in-house Kirin X90, reportedly a 10-core Arm-based SoC, could be Huawei’s answer to Apple Silicon. Powering the new MateBook Pro 2025 as well, the chip is said to be designed by Huawei’s HiSilicon and built on SMIC’s 7nm process.

Before the Kirin X90 came to light, the U.S. Department of Commerce revoked Qualcomm and Intel’s licenses to sell chips to Huawei in May 2024, as per Anue. Shortly after, Huawei’s Executive Director, Richard Yu, revealed that the company was down to its final batch of Windows-powered laptops—future models would run entirely on HarmonyOS, the report explains.

However, Anue notes that Huawei’s earlier desktop efforts relied on a stripped-down Kunpeng 920 server chip—never meant for PCs and used only as a temporary workaround. The report suggests that now, with the Kirin X90, Huawei is making a real leap in homegrown PC processors, following steady progress on the mobile front with the Kirin 9000S and 9020.

Read more

• [News] Huawei Reportedly Builds 7nm AI Chip Line in First Shot at Making Its Own High-End Chips
• [News] Huawei Reportedly Set to Test New Ascend 910D AI Chip as Early as May, Aiming to Challenge NVIDIA
• [News] Huawei’s Ascend 920 Reportedly Set for 2H25 : Concerns Grow Over SMIC’s Capability and HBM Access

(Photo credit: Huawei)