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In 2020, Apple announced its transition to Apple Silicon, successfully replacing Intel processors with more efficient and faster chips in less than three years. Today, Apple intends to replace Qualcomm’s modem chips and gradually internalize all network functionalities.
Apple’s first in-house modem chip, the C1, debuted in the latest iPhone 16e, marking the beginning of its plan to replace Qualcomm. The C1 focuses on efficiency—though it doesn’t support 5G mmWave or the same bandwidth range as Qualcomm’s chips, testing shows excellent performance. In view of its efficiency, the C1 is expected to be used in thinner models like the iPhone 17 Air, rather than the majority of iPhone 17 models.
According to Bloomberg reporter Mark Gurman, Apple plans to fully replace Qualcomm within two product generations. The next modem chip, C2 (codename Ganymede), is expected to launch with the iPhone 18 series in 2026 and be adopted in some iPad models by 2027. The C2 will support mmWave with download speeds up to 6Gbps, Sub-6 six-carrier aggregation, and mmWave eight-carrier aggregation, representing a significant performance boost.
Apple’s third modem chip, the C3 (codename Prometheus), is expected to make its debut in the iPhone 19 series in 2027, aiming to outperform Qualcomm in both performance and AI capabilities.
In addition to modem chips, Apple also plans to replace Broadcom’s network chips. The in-house network chip, codenamed Proxima, is expected to appear in 2025 alongside new versions of the HomePod mini and Apple TV, supporting Wi-Fi 6E. Analyst Ming-Chi Kuo noted that this chip will first be used in the iPhone 17 series in 2025, not just in the iPhone 17 Air, aiming to improve inter-device connectivity and reduce costs.
After completing the modem chip transition, Apple plans to integrate modem functionality into the main Apple Silicon chip to further improve efficiency and reduce costs—a goal expected to be achieved as early as 2028.
(Photo credit: Apple)
