Wafer Fabrication / Foundry

Overview of Global Electronics Sector’s Demand in 2025 | TrendForce

Overview of Global Electronics Sector’s Demand in 2025

Aug 05, 2025 | PDF

In 2025, the electronics industry sees diverging trends: strong AI demand, weak consumer devices, early pull-in erases seasonality, and future growth slows.

Foundry Market Bulletin - Jul. 28, 2025 | TrendForce

Foundry Market Bulletin - Jul. 28, 2025

Jul 28, 2025 | PDF

This report analyzes TSMC, UMC, and PSMC's recent operations and industry outlook, focusing on new plant investments, capacity utilization, product mix, and future technology roadmaps, as well as memo...

Foundry Market Bulletin - Jul. 14, 2025 | TrendForce

Foundry Market Bulletin - Jul. 14, 2025

Jul 14, 2025 | PDF

Samsung restarts US plant expansion driven by policy, but timeline and capacity growth remain uncertain; 2nm order progress depends on yield and client decisions, requiring further observation.

Glass Substrate Breakthroughs: Driving CoWoS and CPO Innovation | TrendForce

Glass Substrate Breakthroughs: Driving CoWoS and CPO Innovation

Jul 07, 2025 | PDF

Glass substrates are emerging as a highly promising solution in advanced semiconductor packaging with recent breakthroughs in Through-Glass Via (TGV) technology. They are poised to drive innovation in...

IC & Semi Research Report-2Q25 | TrendForce

IC & Semi Research Report-2Q25

Jun 30, 2025 | PDF

The semiconductor market is expected to keep growing, driven by industrial automation, AI, and edge computing. The industrial sector relies on mature processes, with Chinese manufacturers expanding ma...

Foundry Market Bulletin - Jun. 30, 2025 | TrendForce

Foundry Market Bulletin - Jun. 30, 2025

Jun 30, 2025 | PDF

UMC focuses on mature processes in China with limited expansion; main growth is in Singapore fab, while Vanguard accelerates capacity in the new Singapore fab, surpassing industry growth.

US to Cancel China Exemptions; Case Review Likely to be Approved | TrendForce

US to Cancel China Exemptions; Case Review Likely to be Approved

Jun 24, 2025 | PDF

US may cancel China facility technology exemptions; however, with mature processes in place, case-by-case reviews are expected to keep the supply chain stable with limited market impact.

Foundry Market Bulletin - Jun. 16, 2025 | TrendForce

Foundry Market Bulletin - Jun. 16, 2025

Jun 16, 2025 | PDF

Foundry Market Update: Samsung utilization rate stable, clients adjust supply chains strategically; China foundry development continues, new processes and regional capacity layouts key.

Foundry Market Bulletin_20250602 | TrendForce

Foundry Market Bulletin_20250602

Jun 02, 2025 | PDF

Regarding changes to orders and capacity utilization of TSMC for 2H25, advanced nodes, including 3nm and 5/4nm...

Foundry Saw 5.4% QoQ Drop in 1Q25 as Tariff-Driven Stocking Activities Offset Traditional Offseason Effects | TrendForce

Foundry Saw 5.4% QoQ Drop in 1Q25 as Tariff-Driven Stocking Activities Offset Traditional Offseason Effects

May 28, 2025 | PDF

As indicated by the survey of global market intelligence firm TrendForce, geopolitical conflicts triggered by new US tariffs...

Hybrid Bonding Technology Heralds a New Era in Advanced Semiconductor Packaging | TrendForce

Hybrid Bonding Technology Heralds a New Era in Advanced Semiconductor Packaging

May 21, 2025 | PDF

As indicated by the survey of global market intelligence firm TrendForce, for decades, Moore's Law has driven the exponential growth of the semiconductor industry...

Foundry Market Bulletin_20250519 | TrendForce

Foundry Market Bulletin_20250519

May 19, 2025 | PDF

Samsung Foundry, due to its client composition, is not benefitting much from China’s subsidies. The combined revenue of Samsung Foundry and System LSI...

Analysis of TSMC’s North America Technology Symposium: Unveiling of Roadmap for Advanced Packaging Solutions and Related Strategy | TrendForce

Analysis of TSMC’s North America Technology Symposium: Unveiling of Roadmap for Advanced Packaging Solutions and Related Strategy

May 07, 2025 | PDF

"TSMC's North America Technology Symposium unveiled a roadmap for advanced packaging solutions, showcasing the 3DFabric® platform, which includes wafer level 3D stacking and advanced packagi...

Analysis of TSMC’s North America Technology Symposium: Unveiling of Roadmap for Advanced Packaging Solutions and Related Strategy | TrendForce

Analysis of TSMC’s North America Technology Symposium: Unveiling of Roadmap for Advanced Packaging Solutions and Related Strategy

May 07, 2025 | PDF

For decades, the semiconductor industry has thrived by adhering to Moore’ Law, achieving rapid development through the continuous miniaturization of transistors...

Foundry Market Bulletin_20250505 | TrendForce

Foundry Market Bulletin_20250505

May 05, 2025 | PDF

TSMC mentioned at the 1Q25 earnings call that 30% of 2nm capacity will be established at its Arizona fab in the future...

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