Wafer Fabrication / Foundry

Hybrid Bonding Technology Heralds a New Era in Advanced Semiconductor Packaging | TrendForce

Hybrid Bonding Technology Heralds a New Era in Advanced Semiconductor Packaging

May 21, 2025 | PDF

As indicated by the survey of global market intelligence firm TrendForce, for decades, Moore's Law has driven the exponential growth of the semiconductor industry...

Foundry Market Bulletin_20250519 | TrendForce

Foundry Market Bulletin_20250519

May 19, 2025 | PDF

Samsung Foundry, due to its client composition, is not benefitting much from China’s subsidies. The combined revenue of Samsung Foundry and System LSI...

Analysis of TSMC’s North America Technology Symposium: Unveiling of Roadmap for Advanced Packaging Solutions and Related Strategy | TrendForce

Analysis of TSMC’s North America Technology Symposium: Unveiling of Roadmap for Advanced Packaging Solutions and Related Strategy

May 07, 2025 | PDF

For decades, the semiconductor industry has thrived by adhering to Moore’ Law, achieving rapid development through the continuous miniaturization of transistors...

Analysis of TSMC’s North America Technology Symposium: Unveiling of Roadmap for Advanced Packaging Solutions and Related Strategy | TrendForce

Analysis of TSMC’s North America Technology Symposium: Unveiling of Roadmap for Advanced Packaging Solutions and Related Strategy

May 07, 2025 | PDF

"TSMC's North America Technology Symposium unveiled a roadmap for advanced packaging solutions, showcasing the 3DFabric® platform, which includes wafer level 3D stacking and advanced packagi...

Foundry Market Bulletin_20250505 | TrendForce

Foundry Market Bulletin_20250505

May 05, 2025 | PDF

TSMC mentioned at the 1Q25 earnings call that 30% of 2nm capacity will be established at its Arizona fab in the future...

Foundry Market Bulletin_20250421 | TrendForce

Foundry Market Bulletin_20250421

Apr 21, 2025 | PDF

Regarding Samsung’s partnerships and negotiations with clients of advanced nodes, Samsung Foundry had previously concluded negotiations with Qualcomm on the 8 series flagship chips through SF2...

Foundry Market Bulletin_20250407 | TrendForce

Foundry Market Bulletin_20250407

Apr 07, 2025 | PDF

Last issue of the Bulletin mentioned how TSMC’s additional investment in the US has also actuated its deployment strategies in other regions of the world...

Foundry Market Bulletin_20250324 | TrendForce

Foundry Market Bulletin_20250324

Mar 24, 2025 | PDF

Looking at changes to Samsung Foundry’s 8-inch orders for 2025, the tendency of localized China for China production...

CoWoS Production Capacity Will Continuously Adjust to Meet Actual Demand, and CSPs Keep Providing Strong Momentum for Orders Related to NVIDIA’s GPUs and In-House ASICs | TrendForce

CoWoS Production Capacity Will Continuously Adjust to Meet Actual Demand, and CSPs Keep Providing Strong Momentum for Orders Related to NVIDIA’s GPUs and In-House ASICs

Mar 14, 2025 | PDF

According to the latest supply chain survey by TrendForce, recent adjustments in TSMC’s CoWoS production capacity can be assessed from both supply and demand perspectives...

CoWoS Production Capacity Will Continuously Adjust to Meet Actual Demand, and CSPs Keep Providing Strong Momentum for Orders Related to NVIDIA’s GPUs and In-House ASICs | TrendForce

CoWoS Production Capacity Will Continuously Adjust to Meet Actual Demand, and CSPs Keep Providing Strong Momentum for Orders Related to NVIDIA’s GPUs and In-House ASICs

Mar 14, 2025 | PDF

"TrendForce reports TSMC's recent CoWoS capacity adjustment is due to prior customer overbooking, but CSP demand remains largely unchanged. 2025 CoWoS total demand is...

Foundry Market Bulletin_20250310 | TrendForce

Foundry Market Bulletin_20250310

Mar 10, 2025 | PDF

TSMC announced on March 4th to be investing US$100 billion in the US for three new phases, two advanced packaging plants, and one R&D center, in Arizona...

Process Transition and Geopolitical Pressures: 2025 Foundry Landscape and Challenges (Presentation) | TrendForce

Process Transition and Geopolitical Pressures: 2025 Foundry Landscape and Challenges (Presentation)

Mar 06, 2025 | PDF

1. Foundry Market Overview 2. Impact of Capacity Supply and Geopolitical Factors 3. AI-Driven Growth in the Foundry Industry 4. TRI’s View

TSMC Expands US Investment to US$165 Billion; US Share of Global Advanced Foundry Capacity Will Rise to 22% by 2030 | TrendForce

TSMC Expands US Investment to US$165 Billion; US Share of Global Advanced Foundry Capacity Will Rise to 22% by 2030

Mar 04, 2025 | PDF

Global market intelligence firm TrendForce reports that TSMC announced on March 4th its intention to increase its investment in advanced semiconductor manufacturing in the United States...

TSMC Expands US Investment to US$165 Billion; US Share of Global Advanced Foundry Capacity Will Rise to 22% by 2030 | TrendForce

TSMC Expands US Investment to US$165 Billion; US Share of Global Advanced Foundry Capacity Will Rise to 22% by 2030

Mar 04, 2025 | PDF

TrendForce indicates that TSMC is expanding its US investment to US$165 billion, establishing six advanced process fabs, two advanced packaging plants, and an R&D center in Arizona. Geopolitical t...

TSMC’s Advanced Nodes Stood Out as Total Revenue of Global Top 10 Foundries Climbed 9.9% QoQ to a New Record in 4Q24 | TrendForce

TSMC’s Advanced Nodes Stood Out as Total Revenue of Global Top 10 Foundries Climbed 9.9% QoQ to a New Record in 4Q24

Mar 04, 2025 | PDF

Global market intelligence firm TrendForce reports that the global foundry industry displayed diverging trends in 4Q24...

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