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Foundry Market Bulletin - May 11, 2026
Last Modified
2026-05-11
Update Frequency
Biweekly
Format
Taiwan foundries see strong 2Q26 rebound, led by TSMC's 3nm ramp and packaging, with peers eyeing HBM and interposer.
Key Highlights
- TSMC: AI demand drives 3nm ramp and packaging push; 2026 outlook raised.
- UMC: PC/NB pull-in lifts utilization; 22nm migration and auto MCU recover.
- Vanguard: DDIC restocking steady; VSMC pivots to CoWoS-S Interposer.
- PSMC: Targets HBM back-end PWF, 1P node and IPD; memory price tailwind.
Table of Contents
- TSMC
- UMC
- Vanguard
- PSMC
- Forecasted Revenue Growth Rate among Taiwanese Foundries for 2026
<Total Pages: 4>
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