AI-driven data centers evolve from single-chip to heterogeneous multi-GPU architectures. High-speed optical interconnects enable scalability, while silicon photonics and co-packaged optics boost bandwidth and energy efficiency amid modular, ecosystem-based competition.

Key Highlights

• Shift from single‑node to multi‑layer collaborative interconnect (Scale‑Up, Scale‑Out, Scale‑Across).
• High‑speed optical interconnects set performance and scalability limits; transceiver demand rises.
• Silicon photonics, co‑packaging and optical I/O reduce power and raise bandwidth.
• Vendors pursue ecosystem integration or modularization, driving system‑level and platform-based competition.

Table of Contents

1. Introduction
   • Shipments of Optical Transceiver Modules in 2025 Have Shown Growth for High-Spec 800G and 1.6T Modules
2. AI Data Center Architectures Are Transitioning from Single-Node Designs to a Hierarchical Collaborative Interconnection Model, Encompassing Scale-Up, Scale-Out, and Scale-Across Architectures
   • Examples of Scale-Up, Scale-Out, and Scale-Across Interconnect Technologies
   • Comparison of Three Major Expansion Architectures for Data Center Networks
3. Rising Demand for High-Bandwidth, Low-Loss Communication Drives Optical Solutions to Replace Copper Wires as Mainstream Interconnects Within Racks and Between Data Centers
   • Optical Communication Modules Are Evolving from Pluggable Forms to ASIC Chips and Will Ultimately Achieve Co-Packaging of Optical Components and ASICs
   • Supply Chain for Integration of Semiconductor Components, Optical Communication Components, and Computing Equipment in Taiwan
4. Future Competitive Landscape: NVIDIA and Broadcom Will Respectively Focus on Ecosystem Integration and Modularization, Driving Growth in Data Center Interconnect Market
   • NVIDIA vs. Broadcom: Comparison of Data Center Interconnect Technologies and Products
5. Market Competition Will Expand from Chip Performance to Development of Systems and Ecosystem Platforms; Enhanced Data Transmission Efficiency Is the Key to Future Success

<Total Pages:8>