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TrendForce: 1H'Dec NAND Flash Contract Prices Slide by 1-3%

23 December 2013

The 1H'Dec NAND Flash contract prices have dropped by 1-3% compared to 2H'Nov, according to DRAMeXchange, a research division of global market research firm TrendForce. The average NAND Flash chip prices for the entire month of November were affected by the quarter-end effect in the US market and the underwhelming demand in the industry, and as a result slid by 10-11% from October. With a good number of the module manufacturers being reserved about the Christmas and Chinese New Year shopping periods, their inventory levels also tended to be higher than usual. On the whole, the NAND Flash suppliers' general unwillingness to resort to price reductions following the massive November shipments can be said to have contributed to the relatively unnoticeable decline in the 1H'Dec NAND Flash contract prices.

TrendForce: 1H’Dec DRAM Contract Price to Continue Rising due to Yield Issues

18 December 2013

According to DRAMeXchange, a research division of TrendForce, the holiday sales momentum and stabilized market shipments are both helping PC-OEMs to digest their inventory. The 1H’Dec contract prices have experienced a slight increase as the yield issues experienced by suppliers remain unresolved. For 4GB, the average prices rose by an estimated 3%, climbing from US$ 33 to US$ 34. The 2GB modules, on the other hand, experienced the same amount of price growth (3%) following the massive reductions in their supplies. Due to the above developments, it is predicted that the contract price uptrend will continue throughout 2H’Dec.

TrendForce: PCIe SSD and TLC SSD to Gain Spotlight in 2014 PC SSD Market

16 December 2013

Two major trends will emerge in the 2014 SSD market, according to DRAMeXchange, a research division of TrendForce. First, PCIe G2 (ie.PCIe Generation 2.0) will replace SATA III as the mainstream item in the high-end SSD market. Second, SATA III TLC SSD will make an impact on the low to mid-end market sectors.

TrendForce: SK Hynix’s Wuxi Fab to Recover Fully from Fire Damage by Mid-January 2014

12 December 2013

According to DRAMeXchange, a division of global research firm TrendForce, damages from the September 4 fire at SK Hynix’s DRAM fabrication plant in Wuxi, China caused a month-long cease in production, and global DRAM supply decreased by 10% in one single month. Therefore, commodity DRAM price trend, initially projected to fall in the second half of the year, has risen by nearly 20% since the fire. Average contract price for 4GB DRAM reached a high of US$33 in the second half of November. However, SK Hynix placed top priority on resuming operations at the Wuxi fab, immediately sending in hundreds of experts to begin the recovery process and working round the clock to decontaminate the clean room. Shortly after the incident, the memory makers replaced some of the fire-damaged equipment with machinery from its M11 fab, and newly purchased equipment has recently been moved into the Wuxi fab. Currently, SK Hynix is on track for a full recovery by mid-January. TrendForce provides the following update with the latest details regarding the recovery of the Wuxi fab:

TrendForce: Mobile DRAM to Become Mainstream within Industry, Account for 40% of DRAM Revenue in 2014

12 December 2013

According to DRAMeXchange, a research division of TrendForce, the impressive sales of smartphones and tablets have prompted DRAM manufacturers to gradually shift their focus from PC DRAM to Mobile DRAM since 2010. The proportion of DRAM revenues accounted for by the latter has risen from 14% in 2010 to about 35% this year, and is expected to show continuous growth in the next two years. Based on comparisons of the supply bit growth figures, Mobile DRAM is likely to not only replace PC DRAM as the mainstream DRAM product in 2014, but also show the largest shipment numbers within the industry.


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