According to a Tom’s Hardware report, a Chinese government assessment on CPU reliability and security has revealed the HiSilicon Kirin X90, a previously unannounced system-on-chip (SoC). Developed by HiSilicon, Huawei’s wholly owned semiconductor subsidiary, this chip is reportedly intended for ...

With NVIDIA launching GTC 2025 and the anticipated debut of GB300, liquid cooling is back in the spotlight. Intel is also ramping up its efforts in the sector, reportedly partnering with Taiwanese suppliers to co-develop its proprietary SuperFluid cooling technology, according to Economic Daily News...

MediaTek has officially set its Dimensity Developer Conference (MDDC 2025) for April 11 in Shenzhen, China. Reports from Sina and IT Home suggest the company will unveil its latest flagship 5G AI chipset, Dimensity 9400+. The Sina Hong Kong report indicates that the first devices powered by thi...

NAND prices are clearly on the rise, with U.S. and South Korean memory giants set to increase prices in April. Now, China’s largest NAND manufacturer YMTC may follow suit. According to Chinese media outlet MyDrivers, the company plans to raise NAND prices next month. The report indicates that Y...

Just as semiconductor veteran Lip-Bu Tan steps in as Intel’s CEO, the company’s 18A node seems to be making early strides. TechPowerUp, citing Intel’s engineering manager Pankaj Marria, reports that initial 18A wafers are already rolling out from the Arizona plant. The progress, according t...