According to a report from Nikkei News, US chip giant Intel will join forces with 14 Japanese companies to develop automation technology for "backend" semiconductor processes such as packaging. The aim is said to achieve automation by 2028, highlighting efforts by both the US and Japan to collaborat...

According to TrendForce's latest memory spot price trend report, due to a significant increase in DRAM module contract prices, some buyers are turning to spot inquiries, leading to partial transactions at lower prices. Meanwhile, NAND Flash prices have shown loosening in spot prices as certain modul...

SK Hynix has been exploring the potential of manufacturing 3D NAND at ultra-low temperatures, which may enable the South Korean memory giant to produce its new-generation product with over 400 layers, South Korea’s media outlet TheElec revealed. According to the report, instead of testing in it...

With the skyrocketing demand for AI, cloud service providers (CSPs) are hastening the development of in-house chips. Apple, making a surprising move, is actively developing a data center-grade chip codenamed "Project ACDC," signaling its foray into the realm of AI accelerators for servers. As per...

According to a report from Economic Daily News citing The Wallstreet Journal, Apple is rumored to be developing its own AI chips tailored for data centers, which could potentially give the world’s top smartphone seller a crucial advantage in the AI arms race. The report, quoting sources familiar w...