Following its North America Technology Symposium, TSMC has shared fresh details on its CoWoS (Chip on Wafer on Substrate with silicon interposer) roadmap. According to Tom’s Hardware, Kevin Zhang, TSMC’s Senior Vice President and deputy COO, confirmed how companies like Cerebras and Tesla (with ...

According to Bloomberg, sources say the U.S. is considering loosening restrictions on NVIDIA chip sales to the United Arab Emirates, with President Donald Trump potentially set to unveil a bilateral semiconductor agreement during his upcoming visit to the Gulf region. The report notes that Trump ...

While its rival ASML saw a huge decline for U.S. sales in the first quarter, ASM International, the most U.S.-exposed among European chip toolmakers, has revealed it has begun producing some of the tools on American soil to get ahead of mounting U.S. tariffs, with Arizona being one of the bases, acc...

Fudan University has achieved a key breakthrough in the field of integrated circuits. The research team led by Zhou Peng and Liu Chunsen has, by constructing a quasi-2D Poisson model, theoretically predicted a phenomenon called "super-injection," breaking through the existing theoretical limits of m...

Recently, Micron Technology announced that it is sampling the industry's first mobile UFS 4.1 and UFS 3.1 products based on its G9 NAND technology, aimed at enhancing the user experience on flagship smartphones. The Micron G9-NAND-based UFS 4.1 delivers faster speed and lower latency. Compared to...